May 11, 2011
SAN JOSE, Calif., May 9, 2011 – Integrated Device Technology, Inc. (IDT®; NASDAQ: IDTI), the Analog and Digital Company™ delivering essential mixed-signal semiconductor solutions, today introduced a new family of low-power, precision temperature sensors targeted at Double Data Rate 2 and 3 (DDR2 and DDR3) memory modules, Solid State Drives (SSD), and computing motherboards. These new devices complement IDT’s PCI Express®, signal integrity, flash memory controller, power management, and timing products to offer a rich set of application optimized enterprise computing solutions.
The digital thermal sensors support both a 3.3V and lower-power 2.5V SM-Bus and I2C interface for improved system power efficiency and compatibility with both existing and emerging serial bus controllers. For further power savings, advanced on-die power management features minimize power consumption during critical modes, such as when mobile or fault-tolerant enterprise systems are operating on battery power. The new product family includes a stand-alone temperature sensor (TS3000GB2), as well as one with an integrated 256-byte EEPROM array (TSE2002GB2) on a single, monolithic die for non-volatile storage of user information, such as system configuration data for the Serial Presence Detect (SPD) feature of the memory module.
The devices continue IDT’s tradition of industry-leading temperature accuracy by exceeding the requirements set forth by the Joint Electron Device Engineering Council (JEDEC) JC42.4 specification for Grade B temperature sensors, providing ±1°C temperature sensing accuracy over the entire temperature range of -20°C to +125°C. In addition, an innovative high-performance analog-to-digital converter (ADC) enables up to 12-bit (0.0625°C) programmable resolution with industry-leading conversion time, dramatically improving precision across the full temperature range.
"Our customers are continually asking for increased system reliability and greater power efficiency, and IDT thermal sensors help us achieve these requirements,” said Arthur Sainio, Sr. Product Manager of SMART Modular Technologies. “We are pleased that IDT offers such a comprehensive portfolio of high-performance computing solutions to address the growing demand of the cloud computing market.”
“As the next generation of computing equipment migrates to lower power and lower voltage architectures, IDT continues to lead those transitions with complete solutions for the memory module market,” said Mario Montana, vice president and general manager of the Enterprise Computing Division at IDT. “Our customers trust IDT to be a leader in performance, power and reliability, and our new family of thermal sensors reinforces that trust.”
Both the TS3000GB2 and TSE2002GB2 support SM-Bus and I2C protocols and specifications, including timeout requirements critical for next generation systems, along with input glitch filtering and power-up voltage hysteresis to enhance fault tolerance in any customer system design.
Pricing and Availability
The IDT temperature sensors are currently sampling to qualified customers. They are available in 8-pin DFN and TDFN packages that are RoHS compliant. The TSE2002GB2 and TS3000GB2 are priced at $0.85 and $0.75 each for volumes of 10,000 units, respectively. For additional information, visit www.idt.com/go/TempSensor .
Integrated Device Technology, Inc., the Analog and Digital Company™, develops system-level solutions that optimize its customers’ applications. IDT uses its market leadership in timing, serial switching and interfaces, and adds analog and system expertise to provide complete application-optimized, mixed-signal solutions for the communications, computing and consumer segments. Headquartered in San Jose, Calif., IDT has design, manufacturing and sales facilities throughout the world.
Large-scale, worldwide scientific initiatives rely on some cloud-based system to both coordinate efforts and manage computational efforts at peak times that cannot be contained within the combined in-house HPC resources. Last week at Google I/O, Brookhaven National Lab’s Sergey Panitkin discussed the role of the Google Compute Engine in providing computational support to ATLAS, a detector of high-energy particles at the Large Hadron Collider (LHC).
Frank Ding, engineering analysis & technical computing manager at Simpson Strong-Tie, discussed the advantages of utilizing the cloud for occasional scientific computing, identified the obstacles to doing so, and proposed workarounds to some of those obstacles.
The private industry least likely to adopt public cloud services for data storage are financial institutions. Holding the most sensitive and heavily-regulated of data types, personal financial information, banks and similar institutions are mostly moving towards private cloud services – and doing so at great cost.
May 16, 2013 |
When it comes to cloud, long distances mean unacceptably high latencies. Researchers from the University of Bonn in Germany examined those latency issues of doing CFD modeling in the cloud by utilizing a common CFD and its utilization in HPC instance types including both CPU and GPU cores of Amazon EC2.
May 10, 2013 |
Australian visual effects company, Animal Logic, is considering a move to the public cloud.
May 10, 2013 |
Program provides cash awards up to $10,000 for the best open-source end-user applications deployed on 100G network.
May 08, 2013 |
For engineers looking to leverage high-performance computing, the accessibility of a cloud-based approach is a powerful draw, but there are costs that may not be readily apparent.
05/10/2013 | Cleversafe, Cray, DDN, NetApp, & Panasas | From Wall Street to Hollywood, drug discovery to homeland security, companies and organizations of all sizes and stripes are coming face to face with the challenges – and opportunities – afforded by Big Data. Before anyone can utilize these extraordinary data repositories, however, they must first harness and manage their data stores, and do so utilizing technologies that underscore affordability, security, and scalability.
04/02/2012 | AMD | Developers today are just beginning to explore the potential of heterogeneous computing, but the potential for this new paradigm is huge. This brief article reviews how the technology might impact a range of application development areas, including client experiences and cloud-based data management. As platforms like OpenCL continue to evolve, the benefits of heterogeneous computing will become even more accessible. Use this quick article to jump-start your own thinking on heterogeneous computing.